منابع مشابه
Wire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
متن کاملOverview of wire bonding using copper wire or insulated wire
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
متن کاملMore uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
The currently high price of gold wire has led to the development of bonding wire made from palladium-coated-copper as a lower cost alternative. Increasing the uniformity of the Pd distribution in free-air balls, formed by melting the wire end with an electric spark, is of interest as it can influence the uniformity of process and reliability. To study this Pd distribution, free-air balls are ma...
متن کاملWire Bonding – A Closer Look
Just like soldering, wire bonding appears to be a simple process and is frequently taken for granted. People tend to think all that is required to have a high quality bonding process is a simple wire pull test to monitor and control the process. But like soldering, this process is complex and requires a thorough understanding of the metallurgy, thermodynamics, and surface chemistry involved. Th...
متن کاملOptimization of the Cu wire bonding process for IC assembly using Taguchi methods
Article history: Received 11 June 2010 Received in revised form 31 July 2010 Accepted 3 September 2010 0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.007 ⇑ Corresponding author. Tel.: +886 3 5742936; fax: E-mail address: [email protected] (C.-T. Su). The yield of IC assembly manufacturing is dependent on wire bonding. Recently, the semiconductor industry dema...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2008
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.11.444